Study in multilayer wiring technology on high-heat-conduction substrates
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)（2021）
Abstract
Inorder to meet the requirements of high heat dissipation, high density and low coefficient of expansion for micro system miniaturization integration, a method for preparing BCB / Cu multilayer wiring based on AISi high thermal conductivity substrate is proposed. The surface treatment of A lSi substrate, the preparation of interface buffer layer of A lSi substrate film, and the through-hole interc...
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Key words
Microsystems,metal substrate,AISi,BCB,Anodic oxidation,thin film multilayer interconnection
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