Analysis Of Shape Memory Behavior And Mechanical Properties Of Shape Memory Polymer Composites Using Thermal Conductive Fillers

MICROMACHINES(2021)

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摘要
Shape memory polymers (SMPs) are attracting attention for their use in wearable displays and biomedical materials due to their good biocompatibility and excellent moldability. SMPs also have the advantage of being lightweight with excellent shape recovery due to their low density. However, they have not yet been applied to a wide range of engineering fields because of their inferior physical properties as compared to those of shape memory alloys (SMAs). In this study, we attempt to find optimized shape memory polymer composites. We also investigate the shape memory performance and physical properties according to the filler type and amount of hardener. The shape memory composite was manufactured by adding nanocarbon materials of graphite and non-carbon additives of Cu. The shape-recovery mechanism was compared, according to the type and content of the filler. The shape fixation and recovery properties were analyzed, and the physical properties of the shape recovery composite were obtained through mechanical strength, thermal conductivity and differential scanning calorimetry analysis.
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关键词
shape memory polymer, thermal conductive filler, shape recovery rate, thermal conductivity, curing condition
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