New 5.2kV StakPak Platform with Innovative Second Generation BIGT chip

Boni Boksteen,Luca De Michielis,Evgeny Tsyplakov,Makan Chen,Daniel Prindle, Franc Dugal,Wolfgang Amadeus Vitale, Andreas Baschnagel,Gontran Paques

PCIM Asia 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management（2021）

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摘要

In this paper we present the novel 5.2kV BIGT chip technology (BIGT2) that has enabled the new advanced StakPak generation. The developed chip is a reverse conducting or Bimode IGBT that has been optimized for low conduction losses re-sulting in a 30% improvement of the current han-dling capability with respect to the previous gener-ation. The BIGT2 chip is based on the rugged en-hanced planar (EP...

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