Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass via Substrate

Chukwudi Okoro, Ah-Young Park,Tammie Allowatt,Scott Pollard

IEEE Transactions on Device and Materials Reliability（2021）

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摘要

This work aims at understanding and eliminating thermo-mechanically induced circumferential cracks that form during cooling for a 400 °C annealed copper (Cu) through-glass via (TGV) with a mean outer diameter of $47.5~\mu \text{m}$ , made in Corning HPFS fused silica glass. An exponential dependence was found between Cu metall...

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关键词

Metallization,Substrates,Stress,Glass,Cooling,Heating systems,Thickness measurement

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