Next-generation Packaging Enabled by an Engineered Copper Nanomaterial
2021 IEEE 21st International Conference on Nanotechnology (NANO)(2021)
摘要
Current and next-generation high power devices require a new set of materials with higher electrical and thermal conductivity to efficiently spread and remove increased waste heat. Kuprion's ActiveCopper technology enables the formation of bulk copper joints at typical soldering temperatures, yet the resulting interconnects are stable up to 500°C or more. This technology has been developed for a n...
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