High Reliability Engineered Copper SMT Bonding Material

Alfred A. Zinn,Randall M. Stoltenberg,Reynaldo Joven,Nhi Ngo,Alexander Capanzana

2021 IEEE 21st International Conference on Nanotechnology (NANO)（2021）

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摘要

We set out to affirm the high reliability of a novel nanocopper-based highly conductive bond agent that allows the formulation of an entire suite of Tunable Engineered Copper (TEC) pastes and inks suited for a wide range of SMT die-bonding and packaging applications. In this paper, we present comprehensive thermal cycling and thermal shock data on 3×3 mm silicon carbide (SiC) dies bonded to patter...

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