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Silicon Photonic Based Stacked Die Assembly Toward 4×200-Gbit/s Short-Reach Transmission

Ying Zhao,Li Chen,Ricardo Aroca,Ninghui Zhu,Dinh Ton,David Inglis,Christopher R. Doerr

Journal of Lightwave Technology（2022）

Cited 8|Views9
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Abstract
We presenta silicon photonic based stacked die assembly (SDA) compatible with the commercial complementary metal-oxide-semiconductor process. The SDA consists of a driver die and a transimpedance amplifier die, both populated onto a photonic integrated circuit die with a dimension of 5 mm×9 mm. The SDA is designed to be an O-band optical engine for a 4×200-Gbit/s parallel single-mode fiber short-r...
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Key words
Optical fiber amplifiers,Radio frequency,Optical fibers,Integrated optics,Optical transmitters,Optical amplifiers,Modulation
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