3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

Stuart Daudlin,Anthony Rizzo,Nathan C. Abrams,Sunwoo Lee,Devesh Khilwani,Vaishnavi Murthy,James Robinson, Terence Collier,Alyosha C. Molnar,Keren Bergman

2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)（2021）

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摘要

We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm(2) bandwidth densities for future co-packaged chipsets. (c) 2021 The Author(s)

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