Hybrid III-V laser integration on a monolithic silicon photonic platform

Yusheng Bian,Koushik Ramachandran,Bo Peng,Brittany Hedrick,Scott Mills, Keith Donegan,Armand Rundquist, Ed Vail, Vaishnavi Karra,Firat Yasar, Monica Esopi, Benjamin Fasano,Asli Sahin,Thomas Houghton,Karen Nummy,Hanyi Ding,Takako Hirokawa, Kevin Dezfulian,Zhuo-Jie Wu,Daniel Fisher,Jim Pape,Jay Steffes,Louis Medina, Subharup Gupta Roy,Harry Cox,Bart Green,Jorge Lubguban,Won Suk Lee,Abdelsalam Aboketaf,Michal Rakowski,Kate McLean,Zoey Sowinski,Oh-Jung Kwon,Gabrielle Robert,Massimo Sorbara,Subramanian Krishnamurthy,Andy Stricker,Jae Kyu Cho, Ian Melville, Dave Riggs,Rod Augur,Norman Robson,Daniel Berger,Luke Lee,Vikas Gupta,Anthony Yu,Ken Giewont,Ted Letavic, John Pellerin

2021 Optical Fiber Communications Conference and Exhibition (OFC)（2021）

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摘要

We report a hybrid flip-chip-integrated laser attach technology on a monolithic SiPh platform. Efficient laser-to-PIC butt-coupling with optical power up to 11dBm was demonstrated through a combination of precise mechanical stops and optical alignment features.

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关键词

(130.3120) Integrated optics devices,(250.5300) Photonic integrated circuits,(250.3140) Integrated optoelectronic circuits

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