Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate

Takeru Amano,Akihiro Noriki,Isao Tamai,Yasuhiro Ibusuki,Akio Ukita,S. Suda,T. Kurosu,Koichi Takemura,T. Aoki,Daisuke Shimura,Yosuke Onawa,Hiroki Yaegashi

2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)（2021）

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摘要

We propose a next generation co-packaged substrate using Si photonics dies, a polymer optical waveguide, and a optical connector to achieve beyond 10 Tb/s and WDM optical links The two micro-mirrors and polymer waveguides were integrated, and their optical characteristics were evaluated.

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关键词

silicon,polymer,waveguide-coupled,co-packaged,photonics-die

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