3D++: Unlocking the Next Generation of High-Performance and Energy-Efficient Architectures using M3D Integration

Biresh Kumar Joardar,Aqeeb Iqbal Arka,Janardhan Rao Doppa,Partha Pratim Pande

2021 Design, Automation & Test in Europe Conference & Exhibition (DATE)（2021）

Cited 5|Views7

No score

Abstract

Three-dimensional (3D) integration has frequently been described as a means to overcome scaling bottlenecks, and advance both “More Moore” and “More Than Moore” through the use of vertical interconnects and die/wafer stacking. Recent industry trends show the viability of 3D integration in real products. Flash memory producers have also demonstrated multiple layers of memory on top of each other. H...

Translated text

Key words

Technological innovation,Three-dimensional displays,Circuits and systems,Stacking,Computer architecture,Market research,Energy efficiency

AI Read Science

Must-Reading Tree

Example

Generate MRT to find the research sequence of this paper

Chat Paper

Summary is being generated by the instructions you defined