Bottom Tier High Voltage Vevice Thermal Stability in 3D Sequential Integration for More than Moore ApplicationsC. Cavalcante, G. Ghibaudo, X. Garros, M. Cassé, T. Karatsori, J. Lacord, C. Fenouillet, N. Rambal, O. Rozeau, J.P. Colinge, M. Vinet, D. Lattard, F. Andrieu, P. BatudeThe Japan Society of Applied Physics（2019）引用 0|浏览0暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
