A Vertically Enhanced Manifold Microchannel System for Thermal Management of Power Electronics

IEEE Transactions on Components, Packaging and Manufacturing Technology(2021)

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摘要
In a more electrified future, development of high power, compact, and synergistically cooled power electronics for improved performance and reliability is of critical importance to a broad range of defense and commercial applications. As power levels increase, power converters must manage higher thermal loads in smaller and lighter weight packages. This necessitates smarter packaging configuration...
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关键词
Heat sinks,Cooling,Electronic packaging thermal management,Microchannels,Manifolds,Packaging,Fluids
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