Molecular plating of actinide compounds on wafer-scale aluminum substrate

•Design profiled anodes to improve the uniformity of current distribution in the molecular-plating of actinide compounds.•A finite element model was utilized to optimize the setup of the anodes and the cell for high-quality plating layer.•Based on the simulations, the inhomogeneity of the molecular-plating actinide layer was decreased to 2.08% experimentally.