Molecular plating of actinide compounds on wafer-scale aluminum substrate
Journal of Alloys and Compounds(2021)
Abstract
•Design profiled anodes to improve the uniformity of current distribution in the molecular-plating of actinide compounds.•A finite element model was utilized to optimize the setup of the anodes and the cell for high-quality plating layer.•Based on the simulations, the inhomogeneity of the molecular-plating actinide layer was decreased to 2.08% experimentally.
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Key words
Molecular plating,Potential distribution,Current distribution,Homogeneity,Actinide oxides
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