Study of Insulating Properties for HV Power Modules

Tingting Wang,Bing Luo, Yongsheng Xu,Fang Qi, Liang Yao, Liang Zeng

PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management（2021）

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摘要

Partial discharge is one of key challenges on high voltage IGBT module packaging design. Electrical field intensity during the operation of the IGBT module is the most important factor affecting its dielectric properties. The finite element method is used to analyze the electrical field intensity distribution and investigate the effect of insulating substrate stacking and geometrical variations on...

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