Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces
2021 44th International Spring Seminar on Electronics Technology (ISSE)（2021）
摘要
One of the hardly predictable issues in the case of solder joints are tin whiskers. Tin whiskers are electrically conductive crystals that spontaneously grow on a surface. This article deals with tin whiskers growth on the three types of metallization (pure tin, SnCu1 and SnCu3 solder alloy) of the copper substrate. Two stressing factors were considered in the experiment – temperature ageing (thre...
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关键词
Temperature measurement,Temperature distribution,Metallization,Wires,Tin,Aging,Copper
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