Exploring flexible and 3D printing technologies for the design of high spatial resolution EM probes
2021 19th IEEE International New Circuits and Systems Conference (NEWCAS)(2021)
Abstract
Electromagnetic analysis of the field radiated by ICs is a common practice in the field of hardware security, especially for reverse engineering or to disclose cryptographic keys. While surprisingly the scaling of CMOS technologies carries on, it is important to scale down the sensors used to perform such analyses. Within this context, this paper explores the potential of flexible and 3D printing ...
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Key words
Side channel attacks,Electromagnetic side channel,Sensor
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