Copper sintered Si 3 N 4 Power Modules in Thermal Shock Tests

The mechanical behavior of Al2O3-DCB and Si3N4-AMB power modules comprising copper sintered SiC-and Si-dice in liquid to liquid thermal shock cycles (LL-TSC) from −40°C to +200 °C is presented. SiC-MOSFET dice from two different vendors and Si-test chips were sintered with and without pressure under H2- and N2-atmosphere onto the substrate. Shear values of pressure-assisted samples sintered at 12 ...