The FinFET effect in Silicon Carbide MOSFETs

F. Udrea,K. Naydenov,H. Kang,T. Kato, E. Kagoshima, T. Nishiwaki,H. Fujiwara, T. Kimoto

2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)(2021)

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Abstract
In ISPSD 2020 it has been shown that the effective mobility of a lateral 4H-SiC MOSFET could be increased by an order of magnitude through using an ultra-narrow-body design. Thus, this work presents further experimental results on a wide set of fin widths, ranging from conventional (860nm) to ultra-narrow (35nm). Furthermore, a 3D TCAD model, employing quantum corrections, is matched to experiment...
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Key words
Semiconductor device modeling,Resistance,Solid modeling,Temperature distribution,Three-dimensional displays,Silicon carbide,FinFETs
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