Improvement of Nanotwinned Copper Thermal Stability for High Temperature Heterogeneous Integration
2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)（2021）
Abstract
The novel nanotwinned copper material was investigated for use as an interconnect material for microelectronic packaging. It provides improved electro-migration and mechanical reliabilities versus traditional Cu interconnects. By adding low level impurities, nt-Cu can be stabilized for a thermal budget of 400 oC for 1h annealing. This technology is promising for high temperature heterogeneous inte...
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Key words
nanotwinned copper thermal stability,high temperature heterogeneous integration,thermal stability
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