Opportunities for 2.5/3D Heterogeneous SoC Integration
2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)（2021）
摘要
As the design complexity grows dramatically in modern circuit designs, 2.5D/3D chip/package/board integration has become effective for optimizing system performance and power consumption. Various 2.5D/3D technologies have been explored. Among many technologies, wafer-level chip-scale packages have been adopted by major companies such as TSMC to achieve high-density, high-performance, low-cost pack...
更多查看译文
关键词
Power demand,Design automation,System performance,Very large scale integration,Tools,Packaging,Timing
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要