A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process

A high-density-3D test-vehicle showcasing a synchronous cache coherent mesh interconnect design (Arm Neoverse ^® CMN-600) operational at frequencies up to 2.4 GHz and partitioned in 3D using 5.76μm pitch face-to-face wafer-bond 3D connections on a 12nm FinFET process is presented. The test-vehicle is designed using an industry tool compatible innovative physical implementation flow and serves as the first known industry demonstration of the IEEE 1838 3DIC Design-for-Test (DFT) standard. We demonstrate a 3D aggregate bandwidth of 307 GB/s, a record bandwidth density of 3.4 TB/s/mm ² , and an energy efficiency of 0.02 pJ/bit for the 3D-stacked dies. We present measurement and analysis data from 945 dies where a total of 13.5 million signal 3D wafer-bond nets and 20 million power-delivery 3D wafer-bond nets on multiple wafer-bonded pairs are tested showing robust functionality, paving the path for 3D-stacked high performance logic-on-logic applications.