Research on Structure and Thermal Analysis of High Power Solid State Power Controller(SSPC)

The structure and thermal analysis of high-power solid-state power controllers (SSPCs) are at the preliminary stage of research at home and abroad. A high-power Multi-chips -parallel SSPC layout structure is proposed to improve the current balance and heat dissipation capability. The parasitic inductance is extracted using finite element software, and the circuit simulation model of parasitic inductance is built in Saber. The heat dissipation simulation experiments is performed on the structure to predict the temperature of the SSPC. The simulation results show that the optimized structure can significantly reduce the current imbalance of the parallel devices and improve the cooling effect by optimizing.