Systematic Design for Mitigation of RF De-sense by Interleaved Power Line in Two-Layer PCB

Chun-Ming Huang,Shih-Hung Wang,Ting-Ying Wu,Ming-Chung Huang,Ruey-Beei Wu

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

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摘要

The RF desense problem in wireless products becomes serious due to faster digital signals and minimal area in print circuit boards (PCBs). This article proposes a systematic design of interleaved power transmission lines to suppress electromagnetic interference due to magnetic coupling from the power delivery system of digital circuits to RF components. It improves noise suppression by more than 2...

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关键词

Inductance,Couplings,Layout,Integrated circuit modeling,Power transmission lines,Packaging,Magnetic flux

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