Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique

A chip to package interaction risk assessment platform has been developed using finite element analysis, meta-modeling and genetic algorithm optimization method to tackle increasing variations in package specifications. The results show that the meta-model can efficiently predict BEOL peeling stress and solder von Mises stress of FCBGA device at reflow condition with eleven design variables. Basel...