Thermohydraulic Performance of Heat Sink with Sinusoidal Microchannels Embedded with Pin-Fins for Liquid Cooling of Microelectronic Chips

This article details the mathematical modeling of a heat sink employing sinusoidal microchannels, embedded with pin-fins, for purposes of liquid cooling of microelectronic chips. The performance of the heat sink is quantified in terms of thermal resistance and pumping power. Studies are done for Reynolds number varying from 250 to 1500. The thermal resistance decreases with increase in Reynolds nu...