Highly Ordered Bn Perpendicular To-Bn(Perpendicular To)Stacking Structure For Improved Thermally Conductive Polymer Composites
Advanced electronic materials(2020)
摘要
The substantial heat generation in modern electronic devices is one of the major issues requiring efficient thermal management. This work demonstrates a novel concept for the design of thermally conducting networks inside a polymer matrix for the development of highly thermally conductive composites. Highly ordered hexagonal boron nitride (hBN) structures are obtained utilizing a freeze-casting method. These structures are then thermally sintered to get a continuous network of BN perpendicular to-BN(perpendicular to)of high thermal conductivity in which a polymer matrix can be impregnated, enabling a directional and thermally conducting composite. The highest achieved thermal conductivity (K) is 4.38 W m(-1)K(-1)with a BN loading of 32 vol%. The effect of sintering temperatures on theKof the composite is investigated to optimize connectivity and thermal pathways while maintaining an open structure (porosity approximate to 2.7%). The composites also maintain good electrical insulation (volume resistivity approximate to 10(14) omega cm). This new approach of thermally sintering BN perpendicular to-BN(perpendicular to)aligned structures opens up a new avenue for the design and preparation of filler alignment in polymer-based composites for improving the thermal conductivity while maintaining high electrical resistance, which is a topic of interest in electronic packaging and power electronics applications.
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关键词
filler alignments, hexagonal boron nitride, high-temperature sintering, polymer composites, thermal conductivity
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