Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors

The novel patch element shapes with the interdigital and multi -via structures for mushroom -type metasurface reflectors are proposed for controlling the reflection phases. The interdigital structure provides a wide reflection phase range by changing the depth of the interdigital fingers. In addition, the multi -via structure provides the higher positive reflection phases such as near +180(degrees). The sufficient reflection phase range of 360(degrees) and the low polarization dependent properties could be confirmed by the electromagnetic field simulation. The metasurface reflector for the normal incident plane wave was designed. The desired reflection angles and sharp far field patterns of the reflected beams could be confirmed in the simulation results. The prototype reflectors for the experiments should be designed in the same way as the primary reflector design of the reflector antenna. Specifically, the reflector design method based on the ray tracing method using the incident wave phase was proposed for the prototype. The experimental radiation pattern for the reflector antenna composed of the transmitting antenna (TX) and the prototype metasurface reflector was similar to the simulated radiation pattern. The effectiveness of the proposed structures and their design methods could be confirmed by these simulation and experiment results.