Performance Characteristics Of Strained Ge P-Finfets Under The Integration Of Lattice And Self-Heating Stress Enabled By Process-Oriented Finite Element Simulation

APPLIED PHYSICS EXPRESS(2021)

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Abstract
Stress-induced mechanism and related manifold characteristics from lattice mismatch and harsh self-heating effect (SHE) substantially interact are major concerns of advanced strained Ge p-FinFETs with inherent poor thermal conductivity. This study presents a process-oriented simulation methodology to investigate the comprehensive influences composed of the stress amplitude and performance variations induced by SHE and lattice stresses. Device performance can be separately improving by 15.98% and 31.20% when lattice strain and subsequent SHE are introduced. In conclusion, the effect of SHE on the performance of advanced p-FinFET is explored and found tantamount to the stress contribution of the lattice mismatch.
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Key words
process-oriented stress simulation, SiGe p-FinFETs, Self-heating effect, Lattice mismatch, Strain engineering
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