Preparation and characterization of a thermal insulating carbon xerogel-epoxy composite adhesive for electronics applications

In some specific microelectronic applications, there is a demand for adhesive materials (glues/encapsulants) having very good thermal insulation properties. We have studied the properties obtained on epoxy-based samples loaded by several levels of xerogel filling. The thermal conductivity of these materials depends on the exact chemical composition and their manufacturing process. As a result, the...