Evolution Dynamics Of Voids In Single Crystal Copper Under Triaxial Loading Condition

An understanding of nucleation, growth and coalescence of voids is required to predict the spall fracture. We employ molecular dynamics simulations to investigate the effect of temperature on the nucleation and growth of voids in single crystal copper under triaxial loading condition. We find that the void density decreases with an increase in temperature. The nucleation rate of the voids diminishes as temperature increases for the range of 300-1250 K. The individual void volume fraction evolves with discrete jumps due to coalescence events. The overall void volume fraction at 1250 K appears earlier than that at 300 K indicating the failure of the material earlier at higher temperatures. The void dimensions evolve with discrete jumps due to coalescence of the voids. The void dimensions change with the applied temperature. The void size distribution at each applied temperature follows a polynomial function.