Reliability Evaluation of IGBT Modules in Wind Power Converter Considering the Effects of Different Failure Sites

2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)(2020)

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Abstract
With the extensive investment of wind turbine, it is significant to study the reliability and lifetime estimation model of its core components. Considering the effect of different failure sites on the remaining lifetime, the response of the converter at failure sites is studied. It is found that die attach solder fatigue and DBC (Direct Bonding Copper) solder fatigue, which happen frequently during the serving time, have different effects on thermal loads. A modified Cauer-type thermal model is proposed according to the failure sites. Using a modified lifetime model, Remaining lifetime of the DFIG (Doubly Fed Induction Generator) converter is calculated under different health conditions and failure sites. Reliability analysis is very important to the health management of converter.
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Key words
Insulated gate bipolar transistor(IGBT),failure sites,thermal model,reliability
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