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紫外成像器件光电阴极封接焊料熔层缺陷对气密性的影响

Journal of Applied Optics(2014)

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Abstract
为解决紫外成像器件光电阴极与管体封接漏气问题,对管体InSn合金熔化过程中出现的质量问题进行了深入分析,找出焊料熔层缺陷主要来源于对焊料除气不彻底和基底表面氧化及设备油污染。通过优化工艺参数,改进工艺质量和把化铟设备管体搁置焊料熔化改为浇铸熔化,使管体焊料熔化合格率达到了100%,光电阴极与管体封接气密性成品率达到98%。
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Key words
ultraviolet imaging device,cathode sealing,solder defects,gas tightness,InSn alloy layer
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