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镍钨硼合金电沉积机理及镀层微晶尺寸

Fang-zu YANG,Gang-min CAO,Xiao HU,Shu-kai XU,Shao-min ZHOU

ELECTROCHEMISTRY（2000）

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Abstract
应用循环伏安、恒电位阶跃和X射线衍射(XRD)等方法研究了Ni-W-B合金电沉积特点和镀层微晶尺寸.结果表明,在以柠檬酸铵为络合剂的溶液中,Ni-W-B合金沉积层较Ni-W合金有较低的电化学活性.电位阶跃i～t曲线分析表明,在玻碳电极上Ni-W-B合金电结晶过程遵循扩散控制瞬时成核三维成长模式,且随过电位的增加,电极表面晶核数增多.XRD测试结果表明,随沉积电流密度提高,合金镀层微晶尺寸逐渐增大,说明电流密度提高将更加有利于Ni-W-B合金电结晶过程中的晶核生长.
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