CCGA引脚去氧化及共面度修整工艺技术研究
China Science & Technology Panorama Magazine(2017)
Abstract
针对CCGA封装后引脚阵列末端共面度差及存在氧化层的问题,对CCGA引脚的打磨抛光进行了相关试验,针对打磨的参数进行了研究,给出了操作简便、可靠有效的工艺方法.
MoreAI Read Science
Must-Reading Tree
Example
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined