Study On The Interfacial Thermal Resistance Between Cnts And Al With A Ttm-Md Model

Interfacial thermal resistance between adjacent parts is important in the design of electronics and MEMS/NEMS devices as well as packaging. In this paper, the two-temperature model (TTM) along with non-equilibrium molecular dynamics (TTM-MD) is used to investigate the interfacial thermal resistance between carbon nanotube (CNT) and aluminium substrate. Factors including the direction of heat flow, temperature dependence and CNT engagement as well as the Al crystal orientation on the resultant interfacial thermal resistance are investigated. Thermal rectification can be observed due to the change of heat flow. Internal Al nanowire filling ratio and the crystal structures of Al substrate are found all significantly affecting the resultant interfacial thermal resistance.