A Wireless Multimodality System-On-A-Chip With Time-Based Resolution Scaling Technique For Chronic Wound Monitoring
2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)(2021)
摘要
The healing process of chronic wounds (CWs) may last for weeks or even months. The process of CW healing relies on many highly regulated factors, such as C-reactive protein (CRP), uric acid (UA), and temperature, which require in-depth observations. Recently, multimodality electrochemistry has been used to acquire biological information pertaining to DNA sequencing [1], neurochemistry research [2] [3], and glucose monitoring [4]. Wound monitoring bandages integrated with modality sensors can provide a comprehensive understanding of the wound healing status [5]. Electrical stimulation has shown several advantages for CW healing, such as increasing the angiogenic response and antibacterial effects, during each healing phase [6]. The temperature index is used to measure the inflammation of the wound. Figure 18.4.1 shows the diagram of the wound healing monitoring bandage. To acquire a large range of biomarkers, the electrochemical instrument must have an extensive operational range, use various scanning methodologies, require low power consumption, and provide high detection resolutions. This work presents a CMOS multimodality system-on-a-chip (SoC) integrated with electrochemical sensors (ECH), a temperature sensor (TS), and a current stimulator (CS).
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关键词
modality sensors,wound healing status,CW healing,healing phase,temperature index,wound healing monitoring bandage,CMOS multimodality system-on-a-chip,temperature sensor,wireless multimodality system-on-a-chip,chronic wound,healing process,uric acid,in-depth observations,multimodality electrochemistry,biological information,DNA sequencing,glucose monitoring,wound monitoring bandages,time-based resolution scaling,neurochemistry research,current stimulator
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