A Wireless Multimodality System-On-A-Chip With Time-Based Resolution Scaling Technique For Chronic Wound Monitoring

2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)(2021)

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摘要
The healing process of chronic wounds (CWs) may last for weeks or even months. The process of CW healing relies on many highly regulated factors, such as C-reactive protein (CRP), uric acid (UA), and temperature, which require in-depth observations. Recently, multimodality electrochemistry has been used to acquire biological information pertaining to DNA sequencing [1], neurochemistry research [2] [3], and glucose monitoring [4]. Wound monitoring bandages integrated with modality sensors can provide a comprehensive understanding of the wound healing status [5]. Electrical stimulation has shown several advantages for CW healing, such as increasing the angiogenic response and antibacterial effects, during each healing phase [6]. The temperature index is used to measure the inflammation of the wound. Figure 18.4.1 shows the diagram of the wound healing monitoring bandage. To acquire a large range of biomarkers, the electrochemical instrument must have an extensive operational range, use various scanning methodologies, require low power consumption, and provide high detection resolutions. This work presents a CMOS multimodality system-on-a-chip (SoC) integrated with electrochemical sensors (ECH), a temperature sensor (TS), and a current stimulator (CS).
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关键词
modality sensors,wound healing status,CW healing,healing phase,temperature index,wound healing monitoring bandage,CMOS multimodality system-on-a-chip,temperature sensor,wireless multimodality system-on-a-chip,chronic wound,healing process,uric acid,in-depth observations,multimodality electrochemistry,biological information,DNA sequencing,glucose monitoring,wound monitoring bandages,time-based resolution scaling,neurochemistry research,current stimulator
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