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RTM用R701氰酸酯树脂工艺及性能

Yueyou WANG,Xuelian BAI,Jia FAN,Qin LEI,Peiluo SHI,Hongjie SUN,Yunfeng ZHAO

Journal of Functional Materials（2017）

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Abstract
研究了一种低粘度、低介电的室温RTM成型用R701氰酸酯树脂体系,并制备了石英纤维织物增强QWB100B/R701复合材料.测试了树脂粘度随时间、温度的变化,不同升温速率下的DSC曲线,树脂浇注体和复合材料的力学、介电、热学和吸水性能.结果表明,树脂粘度适合室温RTM注射成型,适用期在24h以上;树脂浇注体介电常数为3.0,介电损耗为0.009;QWB100B/R701复合材料的Tg为230℃,介电常数为3.4,介电损耗为0.006,R701树脂对石英纤维具有较好的浸润性,复合材料力学性能优异.
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