间位芳纶绝缘纸的温度指数研究
Metallurgy?and?materials（2019）
Abstract
对间位芳纶绝缘纸进行热空气老化试验,试验结果表明其纵向拉伸性能保持率随暴露时间增加而降低.以Arrhenius方程为理论基础,间位芳纶绝缘纸的绝对温度倒数与暴露时间对数展现出良好的线性关系,并推算出该芳纶绝缘纸暴露20000 h时,TI(θ20000)温度指数为227℃,HIC(θ20000～θ2000)半差为39℃.
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