基于BP神经网络的薄板成形回弹仿真预测
Forging & Stamping Technology(2016)
Abstract
基于薄板成形回弹正交试验的设计,利用Dynaform仿真软件对薄板成形回弹进行数值模拟,仿真结果表明:薄板弯曲成形高度随着模具间隙以及弯曲半径的增大而逐渐减小,随着冲压速度以及摩擦系数的增加而不断增大.以模具间隙、弯曲半径、冲压速度以及摩擦系数为输入层,将薄板弯曲成形高度作为输出层,建立4-12-1的3层BP神经网络.基于正交试验数据进行BP神经网络的训练与测试,BP神经网络预测值与有限元模拟值的误差为2.053%.此外,利用薄板成形模具进行试验验证,试验值与BP神经网络预测值的误差为11.87%,从而验证了BP神经网络的可靠性.
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Key words
stamping of sheet metal,orthogonal experiment,numerical simulation,BP neural network,forming springback
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