Ni5W合金基带的热处理工艺
Transactions of Materials and Heat Treatment（2014）
Abstract
为了制备能够满足YBCO涂层导体所需的高强、低磁性基带,采用轧制辅助双轴织构技术(RABiTS)制备Ni-5at％W(Ni5W)合金基带,在不同温度及热处理制度下进行再结晶热处理.采用背散射电子衍射技术对基带织构情况进行研究,结果表明,Ni5W合金基带的初始再结晶温度为700℃,随退火温度升高,轧制织构不断向立方织构转变,在1200℃时立方织构百分含量接近100％.采用700℃预退火30 min后在进行1200℃退火1h后,基带立方织构含量仍然很高,并且比一步退火法获得的立方织构更为锐利.
MoreKey words
annealing, recrystallization ,Ni5W alloy substrate, texture
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