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煅烧温度对化学镀银铜粉性能的影响

Jiali LIN,Ying ZHANG,Mei CAO, Chuliang GONG

Electroplating & Finishing（2020）

Cited 0|Views24
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Abstract
对铜粉化学镀银得到银包铜粉.研究了镀后煅烧温度对银包铜粉颜色、抗氧化性、导电性、形貌和相结构的影响.结果表明,所得银包铜粉接近银白色,银层包覆完整.随煅烧温度升高,银包铜粉的质量增加率和电阻增大,颜色加深,氧化程度加重.但即使经600°C煅烧,银包铜粉的导电性依旧良好,说明其抗氧化性良好,能够在较高温度下使用.
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