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微小互连高度对倒装芯片组装焊点显微组织及力学性能的影响

Shuanjun SHANG, Kai CUI,Yatao ZHAO,Chenyi HOU,Fan CHEN

Electronic Components & Materials（2019）

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Abstract
研究了不同互连高度的Cu/SAC305/Cu焊点的显微组织变化及力学性能.结果表明,随互连高度降低,焊点两侧IMC层的厚度降低,而相应的IMC占焊点的比例却逐渐增高;此外,当互连高度降低,焊料层应变速率及焊点结构系数d/δ均增大,两者共同提高了微焊点的抗拉强度.当焊点互连高度为100,50,20μm时,焊点断口特征均为韧性断裂,而当焊点互连高度为10μm时,其断口特征为脆性断裂.
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