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化学镀铜对厚膜敷铜陶瓷基板敷铜层的影响

Pengfei ZHANG,Renli FU,Fei QIAN,Jun FANG, Weina JIANG

Electronic Components & Materials（2014）

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Abstract
通过化学镀铜对厚膜敷铜陶瓷基板敷铜层进行致密化处理,采用SEM、XRD、导电性测试和结合力测试研究了化学镀铜对敷铜层结构和性能的影响.结果表明:基板敷铜层经化学镀铜处理后,孔洞深度明显变浅、平均孔径由10μm下降为3 μm;表面铜层和中间层结合得更加紧密,敷接强度增加了143.6 N/cm2.同时,基板敷铜层的表面方阻由4.30 mΩΩ/□下降至3.02 mΩΩ/□,敷铜层的导电性能增强.
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