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LTCC基板腔底平整度研究

Shuaiqi YUE,Zhihui LIU,Gang ZHANG,Yang XU

Electronic Components & Materials（2014）

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Abstract
从工艺过程和结构设计两个方面对LTCC(低温共烧陶瓷)基板腔底平整度进行了定量研究.结果显示,在10～30 μm内,填充物与腔体的配合尺寸对腔底平整度影响不大,腔底的翘曲主要是由于通孔分布密度过大所造成的.对于直径为0.15 mm的金属化通孔,孔心间距需达到0.42 mm时才能够获得较好的腔底平整度.
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