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大尺寸2.5D芯片焊接工艺与可靠性分析

Junhua MA,Zhongzhong JIA,Yiming LI,Jian LIANG,Danxia LI, Yu SUN

Electronics Process Technology（2020）

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Abstract
通过对加强型(Stiffener)与盖型(Lid)两种2.5D封装BGA芯片进行焊接工艺与板级焊点可靠性验证,揭示了2.5D芯片特征参数对焊接与可靠性的影响机理,提出了对芯片内部热膨胀系数、共面度和动态翘曲的控制要求,并给出焊接工艺的改善方案.
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