优化压焊工艺QC小组活动与质量的改进
SEMICONDUCTOR OPTOELECTRONICS（2003）
Abstract
主要介绍了QC小组采用先进的工序能力控制技术和6б方法,对压焊工艺进行统计、分析及优化,最后使压焊工艺工序能力指数CPL≥1.33,提高了产品的可靠性.
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