带金手指设计的刚挠结合板尺寸偏移改善
Printed Circuit Information(2016)
Abstract
针对带金手指设计的刚挠结合板,CNC时金手指极易偏移,导致金手指到边距离超出公差范围,文章对此进行了综合分析,采用挠性板内层预设光学点+激光二次成型工艺,可有效改善金手指偏移问题,控制偏移公差在±0.05mm以内,极大提高了产品一次良率,为批量生产奠定了技术基础.
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