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键合机芯片翻转机构及其动力学仿真

Song GUO,Huanhuan ZHU, Feibiao CHEN

Equipment for Electronic Products Manufacturing（2018）

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Abstract
在Fine-Out(扇出)芯片键合制程中需要对芯片(Die)进行重新布局,由于制造工艺的不同,芯片标记面可能存在向上或向下工况.介绍了芯片翻转机构的工作流程和设计开发过程.
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