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基于双目立体视觉的IC板深度测量

Yun-fei XI,Shuang WU,Jian XU,Rong-lu MA,Xiao-hang YOU

Manufacturing Automation（2020）

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Abstract
为了测量批量生产的IC板深度,搭建了一套双目立体视觉系统,介绍了双目视觉测量原理和测量过程,结合HALCON视觉处理软件开发了图像处理算法,通过立体匹配获取到了左右相机的视差图,最终根据视差图像计算出了IC零件的深度,实现了对IC零件深度的准确测量.实验结果表明,该方法可较精确的测量出IC零件深度.
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